ligitek electronics co.,ltd. property of ligitek only LVG3331-PF data sheet super bright round type led lamps doc. no : qw0905- rev. : date : a - 2005 05 - sep LVG3331-PF lead-free parts pb
0 x -60 x 100% 50% 75% 25% -30 x 100% 25% 050%75% 30 x 60 x ligitek electronics co.,ltd. property of ligitek only package dimensions directivity radiation note : 1.all dimension are in millimeter tolerance is ? 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. 25.0min 2.54typ 1.0min ?? 0.5 typ LVG3331-PF part no. 1.5max 7.6 8.6 5.0 5.9 page 1/5 + -
page ligitek electronics co.,ltd. property of ligitek only unit vg ratings ma ma 30 120 g a j 10 -40 ~ +85 max 260 j for 5 sec max (2mm from body) j -40 ~ +100 100 mw typ. min. max. luminous intensity @20ma(mcd) min. spectral halfwidth ??f nm peak wave length f pnm forward voltage @ ma(v) 20 450 300 30 565 viewing angle 2 c 1/2 (deg) part no. LVG3331-PF symbol parameter i f i fp forward current peak forward current duty 1/10@10khz ir t opr operating temperature reverse current @5v tsol soldering temperature storage temperature tstg power dissipation pd color lens emitted part no material typical electrical & optical characteristics (ta=25 j ) absolute maximum ratings at ta=25 j note : 1.the forward voltage data did not including ? 0.1v testing tolerance. 2. the luminous intensity data did not including ? 15% testing tolerance. 2/5 LVG3331-PF gap green transparent green 1.7 2.6 20
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( j ) relative intensity@20ma wavelength (nm) forward voltage@20ma normalize @25 j fig.4 relative intensity vs. temperature ambient temperature( j ) relative intensity@20ma normalize @25 j typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage forward current(ma) forward current(ma) fig.2 relative intensity vs. forward current relative intensity normalize @20ma ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0 10 100 1000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40 -20 0 20 40 60 1.0 1.1 1.2 500 550 600 650 0.0 0.5 1.0 2.0 3.0 4.0 5.0 80 100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 vg chip 3.5 page 3/5 part no. LVG3331-PF
120x 260x time(sec) temp(c) dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 3 c/sec(max) ramp-down:-5c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to case) 260 c3sec max preheat 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350c max soldering time:3 seconds max(one time) distance:2mm min(from solder joint to case) 60 seconds max 3 /sec max 5 /sec max 25x ligitek electronics co.,ltd. property of ligitek only page 4/5 part no. LVG3331-PF
thermal shock test solderability test solder resistance test high temperature high humidity test mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202:103b jis c 7021: b-11 the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. this test intended to see soldering well performed or not. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this test is the resistance of the device under tropical for hous. 1.t.sol=260 j? 5 j 2.dwell time= 10 ? 1sec. 1.t.sol=230 j? 5 j 2.dwell time=5 ? 1sec 1.ta=105 j? 5 j &-40 j? 5 j (10min) (10min) 2.total 10 cycles 1.ta=65 j? 5 j 2.rh=90 %~95% 3.t=240hrs ? 2hrs part no. LVG3331-PF reliability test: high temperature storage test low temperature storage test operating life test test item page mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 jis c 7021: b-12 mil-std-883:1008 jis c 7021: b-10 reference standard ligitek electronics co.,ltd. property of ligitek only the purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. this test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, + 72hrs) 1.ta=105 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) 1.ta=-40 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) test condition description 5/5
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